-
THERM PAD 32.92M X 48.01MM W/ADH
Please send RFQ , we will respond immediately.
Quantity:
HS3K R6G
Taiwan Semiconductor Corporation
VE-24H-EX-B1
Vicor Corporation
FW-50-05-L-D-340-160
Samtec Inc.
895-005-559-608
EDAC Inc.
AT27C020-70JC
Microchip Technology