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5.0MM X 3.2MM 2-PAD SURFACE MOUN
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Quantity:
TLVH431AQDBVR,115
NXP USA Inc.
B82442A1103K000
EPCOS - TDK Electronics
634-026-263-012
EDAC Inc.
DSC1203DI3-100M0000T
Microchip Technology
M85049/25-102Z
Amphenol Interconnect India
