28-FlatPack, Ceramic Bottom-Brazed
IC EEPROM 256KBIT PAR 28FLATPK
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Quantity:
MS27508E16B6P
Conesys
ELG478M063AT2AA
KEMET
A17689-19
Laird Technologies - Thermal Materials
C44-NWL5H-CWO
Visual Communications Company - VCC
A604CH
Hoffman Enclosures, Inc.
