CUI Devices HSB10-232306

HEAT SINK, BGA, 23 X 23 X 6 MM

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Company name

Telephone

Country

Quantity:

IXDI404SI

IXYS

QTM532-133.000MDE-T

QST

S4AF1C-P12MFG0-500S

ODU

DTS20T17-06SC3028

TE Connectivity Deutsch Connectors

AA2-B0-44-630-3G1-C

Carling Technologies