CUI Devices HSB19-272718

HSB19-272718

-

HEAT SINK, BGA, 27 X 27 X 18 MM

In Stock : Please Inquiry

Please send RFQ , we will respond immediately.

Contact Name

Email

Company name

Telephone

Country

Quantity:

Hot Datasheet

CA3101E28-16PBF80F0

ITT Cannon, LLC

22552

Brady Corporation

PIC12HV615-E/SN

Microchip Technology

P1206H6191FBTA

Vishay Sfernice

1140-6-AL-24

RAF Electronic Hardware