CUI Devices HSE-B18508-035H

HEAT SINK, EXTRUSION, TO-218, 50

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FGG.0B.305.CYCZ

LEMO

FFSD-10-D-12.00-01-N-D03-R

Samtec Inc.

CPPLX8-A7BRNP

Cardinal Components Inc.

XC9142F42D0R-G

Torex Semiconductor Ltd

RP110N121B-TR-FE

Nisshinbo Micro Devices Inc.