HSS08-B18-CP

CUI Devices

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HSS08-B18-CP

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HEAT SINK, STAMPING, TO-218, 44.

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Shape	Square
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.492" (12.50mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	3.50°C/W @ 200 LFM
Length	1.750" (44.45mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	7.29°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	PC Pin
Width	1.750" (44.45mm)
Diameter	-
Power Dissipation @ Temperature Rise	10.3W @ 75°C
Package Cooled	TO-218