SEAFP-50-01-S-08-RA-WT

Samtec Inc.

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CONN HD ARRAY F 400POS P-FIT R/A

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Number of Rows	8
Number of Positions	400
Contact Finish Thickness	30.0µin (0.76µm)
Contact Finish	Gold
Height Above Board	-
Mounting Type	Through Hole, Right Angle, Press-Fit
Product Status	Active
Series	SEARAY™ SEAFP
Pitch	0.050" (1.27mm)
Mfr	Samtec Inc.
Connector Type	High Density Array, Female
Features	Solder Retention
Package	Tray
Mated Stacking Heights	-
Base Product Number	SEAFP-50