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HSS-C2540-SMT-TR

CUI Devices

Product No:

HSS-C2540-SMT-TR

Manufacturer:

CUI Devices

Package:

-

Batch:

-

Datasheet:

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Description:

HEAT SINK TO-263 COPPER

Quantity:

Delivery:

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Payment:

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In Stock : Please Inquiry

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Product Information

Parameter Info

User Guide

Shape Rectangular, Fins
Material Copper
Product Status Active
Fin Height 0.450" (11.43mm)
Series HSS
Thermal Resistance @ Forced Air Flow 5.50°C/W @ 200 LFM
Type Board Level
Length 0.763" (19.38mm)
Mfr CUI Devices
Thermal Resistance @ Natural 21.90°C/W
Package Tape & Reel (TR)
Material Finish Tin
Attachment Method -
Width 1.000" (25.40mm)
Diameter -
Power Dissipation @ Temperature Rise 3.8W @ 75°C
Package Cooled TO-263 (D²Pak)
Base Product Number HSS-C2540