HSS14-B20-NP

CUI Devices

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HSS14-B20-NP

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HEAT SINK, STAMPING, TO-220, 19.

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Shape	Rectangular
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.157" (4.00mm)
Series	HSS
Type	Board Level, Vertical
Thermal Resistance @ Forced Air Flow	11.60°C/W @ 200 LFM
Length	0.980" (24.89mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	23.91°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	-
Width	0.750" (19.05mm)
Diameter	-
Power Dissipation @ Temperature Rise	3.1W @ 75°C
Package Cooled	TO-220