HSB01-080808

CUI Devices

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HSB01-080808

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HEAT SINK, BGA, 8.5 X 8.5 X 8 MM

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Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.315" (8.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	16.00°C/W @ 200 LFM
Length	0.335" (8.50mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	39.10°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive (Not Included)
Width	0.335" (8.50mm)
Diameter	-
Power Dissipation @ Temperature Rise	1.9W @ 75°C
Package Cooled	BGA