HSB03-141406

CUI Devices

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HSB03-141406

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HEAT SINK, BGA, 14 X 14 X 6 MM

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Shape	Square, Pin Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	0.236" (6.00mm)
Series	HSB
Type	Top Mount
Thermal Resistance @ Forced Air Flow	15.80°C/W @ 200 LFM
Length	0.551" (14.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	35.98°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	Adhesive
Width	0.551" (14.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	2.1W @ 75°C
Package Cooled	BGA