HSE05-171933

CUI Devices

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HSE05-171933

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HEAT SINK, EXTRUSION, TO-218/TO-

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Shape	Rectangular, Angled Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	1.280" (32.50mm)
Series	HSE
Type	Board Level
Thermal Resistance @ Forced Air Flow	6.90°C/W @ 200 LFM
Length	0.764" (19.40mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	18.83°C/W
Package	Box
Material Finish	Black Anodized
Attachment Method	PC Pin
Width	0.669" (17.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	3.98W @ 75°C
Package Cooled	TO-218, TO-220