HSE08-505028

CUI Devices

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HSE08-505028

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HEAT SINK, EXTRUSION, TO-218/TO-

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Shape	Rectangular, Angled Fins
Material	Aluminum Alloy
Product Status	Active
Fin Height	1.969" (50.00mm)
Series	HSE
Type	Board Level
Thermal Resistance @ Forced Air Flow	2.70°C/W @ 200 LFM
Length	1.969" (50.00mm)
Mfr	CUI Devices
Thermal Resistance @ Natural	7.13°C/W
Package	Bag
Material Finish	Black Anodized
Attachment Method	Clip
Width	1.102" (28.00mm)
Diameter	-
Power Dissipation @ Temperature Rise	10.53W @ 75°C
Package Cooled	TO-218, TO-220